Supercritical cleaning technology principle
The best parameters for Supercritical cleaning :
Extraction temperature:32 °C
The purpose of cleaning is to effectively remove pollutants and impurities such as particles, metal ions or organic matter on the residual surface or between pores without destroying the precise parts or circuit boards and their characteristic functions.
Due to the porosity of precision parts, the surface area is relatively high compared to the cleaning method during cleaning. The cleaning agent cannot effectively penetrate into the gap. Due to the surface tension and large viscosity of the liquid, it is difficult to clean small voids. Thoroughly clean it; even multiple cleanings cannot effectively improve the cleaning rate, take time and effort and cause more pollution, and may cause damage to the fragile structure inside the part; at the same time, precision components or components and interconnections in the circuit board The scale is very small. If particles, metal or organic substances are encountered during the manufacturing process, it is easy to cause internal function damage and blockage.
In addition, in the traditional cleaning technology, in addition to the use of the largest amount of water without damage to the parts, the acid, alkali, plasma and ultrasonic cleaning used in other technologies have more or less damage to the device;
Supercritical cleaning principle:
In general, the solubility of supercritical CO2 increases with the increase of pressure. Changing the pressure and temperature appropriately will cause the solubility to change within the range of 102 to 103 times. Supercritical CO2 cleaning technology uses this feature. Increasing the pressure during cleaning can make the pollutants dissolve in supercritical CO2 to the maximum extent. At the same time, because the surface tension is relatively small, it is difficult for ordinary liquid solvents to penetrate the precision-grade micropores, and cleaning with supercritical media is also possible. After the cleaning is completed, CO2 can be effectively and completely separated from the pollutants by decompression or temperature reduction, thereby completing a cleaning process.
Supercritical cleaning application areas:
Electrical and electronics industry: including cleaning of printed circuit boards, silicon wafers, hard drives, semiconductor wafers, wafers, photomasks and other microelectronics components;Defense industry: cleaning of aerospace components such as missile gyroscopes, instrument bearings, accelerometers, avionics, satellites or landing craft, and nuclear power components;Waste treatment: including removal of non-VOC components in waste, soil purification, activated carbon, catalyst regeneration, separation of organic poisons, PCB treatment of waste transformers, etc .
Food industry: including the application of cleaning edible rice, kitchenware, oil fume pipes, etc .
Precision machinery industry: Including precision bearings, micro transmission components, fuel nozzles, micro-electromechanical components, aluminum / magnesium alloy die castings, catalyst converters and hydraulic valves, hydraulic pumps and other metal parts; cleaning organic, weak polar pollution ThingsOptical industry: including cleaning of optical components such as laser lenses, contact lenses, camera lenses, fiber optic components, testing instruments, LCD components, flat panel displays, etc .
Medical equipment industry: including cleaning of endoscopes, heart rate regulators, hemodialysis tubes, urinary catheters and casings, human implants, sutures, surgical instruments and other equipment;
Nanomaterials: Including nanomaterials or components, semiconductor components, photoresists, low dielectric constant materials and other cleaning tools or materials.