SCF cleaning integrated circuit board process parameters
Laboratory equipment:L-05
Cleaning pressure: <10 MPa
Separation pressure: 6 MPa
Cleaning time: <90 min
This is an experiment, on July 1, 2020.
At the request of Taiwan Songhao Electromechanical Company, we carried out the IC board cleaning test.
The samples are 5 pieces of circuit boards that have been cut. From the photos, we can find that the soldering aid is very obvious and difficult to remove by conventional methods.
Parameters in the first test
Number of cleaning pieces: 2 pieces
Cleaning pressure: 15MPa.
CO2 flow rate: slightly
Cleaning time: 20 minutes
Cleaning result: good
Parameters in the first test
Number of cleaning pieces: 3 pieces
Cleaning pressure: 9MPa.
Other processes: slightly
CO2 flow rate: slightly
Cleaning time: 15 minutes
Cleaning result: very good
